Q&A: Incus GmbH discusses its metal photopolymerisation 3D printing technology

It was two weeks out from Formnext when the additive manufacturing industry was introduced to Incus, a company spun out from ceramic 3D printing vendor Lithoz.  In late October, Incus announced the launch of its metal photopolymerisation technology, which has been developed within Lithoz’ R&D facilities in Vienna over the last few years, and promises ‘the finest of surface structures’ using materials with similar properties to metal injection moulding. As the company debuted at Formnext, TCT Magazine dropped by the stand to pose a few questions to CEO Dr Gerald Mitteramskogler (GM). GM: We’re using a lithography-based approach for the production of metal powders. Similar to Lithoz, we have photopolymer resin that is filled with metal powder. We use finer powder, so basically all of the powders that are possible for metal injection moulding are possible with our approach as well. So, using the principle of stereolithography or vat photopolymerisation or DLP, we are creating, layer by layer, a 3D printed green part. The green part is the mixture of the photopolymer that’s holding together the metal powder and then we put the green part into the sintering furnace for debinding ...

Nano Dimension’s DragonFly Pro offers faster assembly for BGAs and SMT components

Nano Dimension Ltd. recently announced that its DragonFly Pro electronics 3D printing system has successfully shortened the assembly process for ball grid arrays (BGAs) and other surface mount technology (SMT) parts for integrated circuits from days to roughly one hour. The milestone was achieved through a recent qualification study led by Nano Dimension’s Application Engineering team. Traditionally, the process of designing, printing, soldering, manufacturing, assembling and completing reflow for BGAs and SMT components would take weeks to complete. With Nano Dimension’s additive manufacturing platform, however, the process was dramatically streamlined. That is, the DragonFly Pro is capable of printing a special layout structure of PBCs that does not require any additional special tooling or assembly. This, in turn, allows for in-house manual assembly of BGAs and SMT components throughout the design and application development phase. BGA and SMT components are found in most electronic devices, from phones and watches to cars and airplanes. BGAs are a type of surface-mount packaging (a chip carrier) used for integrated circuits and which provide more interconnection pins than a ...